热管理 - MingCome electronic

筛选：

938 条记录

零件号	制造商	描述	最小起订量		库存	操作
HSB27-434316	CUI Devices	HEAT SINK, BGA, 43.1 X 43.1 X 16	1	PDF RFQ	45,695 现货	获取报价
HSE02-173213P	CUI Devices	HEAT SINK, EXTRUSION, 17 X 31.9	1	PDF RFQ	11,553 现货	获取报价
HSE07-753045	CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	1	PDF RFQ	20,908 现货	获取报价
HSB28-606022	CUI Devices	HEAT SINK, BGA, 60 X 60 X 22 MM,	1	PDF RFQ	8,500 现货	获取报价
HSS-B20-0635H-01	CUI Devices	HEATSINK TO-220 2.7W ALUMINUM	1	PDF RFQ	13,569 现货	获取报价
HSS-B20-CP-01	CUI Devices	HEATSINK TO-220 2.6W ALUMINUM	1	PDF RFQ	41,227 现货	获取报价
HSE-B20250-040H-01	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	1	PDF RFQ	13,850 现货	获取报价
HSE-B20254-035H	CUI Devices	HEAT SINK, EXTRUSION, TO-220,25.	1	PDF RFQ	33,742 现货	获取报价
HSB06-181810	CUI Devices	HEAT SINK, BGA, 18 X 18 X 10 MM	1	PDF RFQ	11,623 现货	获取报价
HSS13-B20-NP	CUI Devices	HEAT SINK, STAMPING, TO-220, 31	1	PDF RFQ	18,224 现货	获取报价

8 / 47 Page, 938 Records