热管理 - MingCome electronic

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938 条记录

零件号	制造商	描述	最小起订量		库存	操作
HSE05-171933	CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	1	PDF RFQ	18,234 现货	获取报价
HSE02-173213	CUI Devices	HEAT SINK, EXTRUSION, 17 X 31.9	1	PDF RFQ	17,375 现货	获取报价
HSB15-404010	CUI Devices	HEAT SINK, BGA, 40 X 40 X 10 MM	1	PDF RFQ	10,962 现货	获取报价
HSE-B18254-0396H	CUI Devices	HEAT SINK, EXTRUSION,TO-218, 25.	1	PDF RFQ	37,813 现货	获取报价
HSE-B18508-035H	CUI Devices	HEAT SINK, EXTRUSION, TO-218, 50	1	PDF RFQ	41,930 现货	获取报价
HSE01-193175P	CUI Devices	HEAT SINK, EXTRUSION, 19 X 31.5	1	PDF RFQ	33,679 现货	获取报价
HSB20-353525	CUI Devices	HEAT SINK, BGA, 35 X 35 X 25 MM	1	PDF RFQ	18,388 现货	获取报价
HSB30-373710	CUI Devices	HEAT SINK, BGA, 37.4 X 37 X 10 M	1	PDF RFQ	26,920 现货	获取报价
HSE06-503045	CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	1	PDF RFQ	35,112 现货	获取报价
HSE08-505028	CUI Devices	HEAT SINK, EXTRUSION, TO-218/TO-	1	PDF RFQ	23,564 现货	获取报价

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