热管理 - MingCome electronic

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938 条记录

零件号	制造商	描述	最小起订量		库存	操作
HSE-B20381-035H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 38	1	PDF RFQ	38,636 现货	获取报价
HSE-B20380-040H-01	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 38	1	PDF RFQ	20,450 现货	获取报价
HSE-B20254-040H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	1	PDF RFQ	33,538 现货	获取报价
HSB26-343408	CUI Devices	HEAT SINK, BGA, 33.5 X 33.5 X 8	1	PDF RFQ	32,265 现货	获取报价
HSE-B20500-040H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 50	1	PDF RFQ	27,305 现货	获取报价
HSE-B20254-056H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	1	PDF RFQ	5,039 现货	获取报价
HSS04-B20-P318	CUI Devices	HEAT SINK, STAMPING, TO-220, 41.	1	PDF RFQ	16,065 现货	获取报价
HSB25-282810	CUI Devices	HEAT SINK, BGA, 28.5 X 28.5 X 10	1	PDF RFQ	49,355 现货	获取报价
HSE01-193175	CUI Devices	HEAT SINK, EXTRUSION, 19 X 31.5	1	PDF RFQ	29,250 现货	获取报价
HSS07-C20-P274	CUI Devices	HEAT SINK, STAMPING, TO-220, 21.	1	PDF RFQ	31,213 现货	获取报价

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