热管理 - MingCome electronic

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938 条记录

零件号	制造商	描述	最小起订量		库存	操作
HSB18-232310	CUI Devices	HEAT SINK, BGA, 23 X 23 X 10 MM	1	PDF RFQ	5,414 现货	获取报价
HSE-B250-04H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25	1	PDF RFQ	30,391 现货	获取报价
HSS03-B20-P318	CUI Devices	HEAT SINK, STAMPING, TO-220, 41.	1	PDF RFQ	35,440 现货	获取报价
HSS02-B20-P318	CUI Devices	HEAT SINK, STAMPING, TO-220, 23.	1	PDF RFQ	11,699 现货	获取报价
HSB23-232325	CUI Devices	HEAT SINK, BGA, 23 X 23 X 25 MM	1	PDF RFQ	21,505 现货	获取报价
HSS01-B20-CP	CUI Devices	HEAT SINK, STAMPING, TO-220, 49.	1	PDF RFQ	42,076 现货	获取报价
HSB14-353518	CUI Devices	HEAT SINK, BGA, 35 X 35 X 18 MM	1	PDF RFQ	18,875 现货	获取报价
HSB16-404018	CUI Devices	HEAT SINK, BGA, 40 X 40 X 18 MM	1	PDF RFQ	40,946 现货	获取报价
HSB17-404025	CUI Devices	HEAT SINK, BGA, 40 X 40 X 25 MM	1	PDF RFQ	26,894 现货	获取报价
HSS-B20-065V-02	CUI Devices	HEATSINK TO-220 2.9W ALUMINUM	1	PDF RFQ	14,917 现货	获取报价

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